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COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, COPPER ALLOY THIN PLATE FOR ELECTRONIC/ELECTRIC DEVICE, METHOD OF PRODUCING COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRONIC/ELECTRIC DEVICE AND TERMINAL
COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, COPPER ALLOY THIN PLATE FOR ELECTRONIC/ELECTRIC DEVICE, METHOD OF PRODUCING COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRONIC/ELECTRIC DEVICE AND TERMINAL
What is provided is a copper alloy for electronic/electric device comprising: in mass %, more than 2.0% and 36.5% or less of Zn; 0.1% or more and 0.9% or less of Sn; 0.05% or more and less than 1.0% of Ni; 0.001% or more and less than 0.10% of Fe; 0.005% or more and 0.10% or less of P; and the balance Cu and inevitable impurities, wherein a content ratio of Fe to Ni, Fe/Ni, in atomic ratio satisfies 0.002≤Fe/Ni1.5, a content ratio of a sum of Ni and Fe, (Ni+Fe), to P, in atomic ratio satisfies 3(Ni+Fe)/P15, a content ratio of Sn to a sum of Ni and Fe, (Ni+Fe), in atomic ratios satisfies 0.3Sn/(Ni+Fe)5, an average crystal grain diameter of a matrix of the copper alloy, which is mainly α phase containing Cu, Zn, and Sn is in a range of 0.1 to 50 µm, the copper alloy includes precipitates containing P and one or more elements selected from Fe and Ni, and a ratio of sampling points having a Confidence Index (CI) value of 0.1 or less is 70% or less in the α phase, the CI value being acquired by measuring an area of not smaller than 1000 µm2 by EBSD method with 0.1 µm step intervals and analyzing the measurement data with an OIM data analysis software.
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机译:提供了一种用于电子/电气设备的铜合金,其包含:以质量%计,大于2.0%且36.5%以下的Zn;和Sn:0.1%以上0.9%以下; Ni的0.05%以上且小于1.0%; 0.001%以上且小于0.10%的Fe; P的0.005%以上且0.10%以下;余量的Cu和不可避免的杂质,其中Fe与Ni的含量比,Fe / Ni,以原子比满足0.002≤Fe/ Ni <1.5,Ni和Fe之和,(Ni + Fe),对于P,原子比满足3 <(Ni + Fe)/ P <15,Sn与Ni和Fe之和的含量比(Ni + Fe)以原子比满足0.3 2 Sup>,并使用OIM数据分析软件分析测量数据。
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