VOID STRUCTURED FILM BONDED THROUGH CATALYTIC ACTION AND METHOD FOR MANUFACTURING SAME

摘要

The present invention provides, for example, a film with void spaces having a porous structure with less cracks and a high proportion of void space as well as having a strength. The film with void spaces of the present invention includes one kind or two or more kinds of structural units that form a structure with minute void spaces, wherein the structural units are chemically bonded through catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The film with void spaces can be produced, for example, by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products, for example.