首页> 外国专利> VOID STRUCTURED FILM BONDED THROUGH CATALYTIC ACTION AND METHOD FOR MANUFACTURING SAME

VOID STRUCTURED FILM BONDED THROUGH CATALYTIC ACTION AND METHOD FOR MANUFACTURING SAME

机译:通过催化作用结合的空泡结构膜及其制造方法

摘要

To provide a void structured film which forms a porous structure having, for example, high porosity while suppressing occurrence of cracks and also has strength.SOLUTION: The void structured film of the present invention includes one or a plurality of kinds of structural units which form a fine void structure. The constitutional units are chemically bonded to each other through catalytic action. For example, the void structured film of the present invention has abrasion resistance measured with BEMCOT (trade mark) in the range from 60% to 100%, and folding endurance measured by the MIT test is 100 times or more. The void structured film can be produced, for example, by forming a precursor of the silicone porous body using sol containing a pulverized product of a gelled silicon compound and then chemically bonding the pulverized product contained in the precursor of the silicone porous body. The chemical bonding of the pulverized product with each other is, for example, preferably chemical crosslinking thereof.SELECTED DRAWING: None
机译:提供一种空隙结构化膜,其形成具有例如高孔隙率同时抑制裂纹的产生并还具有强度的多孔结构。解决方案:本发明的空隙结构化膜包括一种或多种形成的结构单元。精细的空隙结构。构成单元通过催化作用彼此化学键合。例如,本发明的空隙结构化膜的利用BEMCOT(商标)测定的耐磨耗性在60%〜100%的范围内,通过MIT试验测定的耐折性为100倍以上。可以通过例如使用含有凝胶状硅化合物的粉碎物的溶胶形成有机硅多孔体的前体,然后将有机硅多孔体的前体中包含的粉碎体化学键合来制造空隙结构化膜。粉碎产物彼此之间的化学键合例如优选是其化学交联。

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