首页> 外国专利> PREPREG FOR CORELESS SUBSTRATE, METHOD AND DEVICE FOR PRODUCING PREPREG FOR CORELESS SUBSTRATE, CORELESS SUBSTRATE, AND METHOD FOR PRODUCING THE SAME

PREPREG FOR CORELESS SUBSTRATE, METHOD AND DEVICE FOR PRODUCING PREPREG FOR CORELESS SUBSTRATE, CORELESS SUBSTRATE, AND METHOD FOR PRODUCING THE SAME

机译:用于相关基质的预浸剂,用于制备相关基质的预浸剂,方法和装置,以及用于制备相同基质的方法

摘要

PROBLEM TO BE SOLVED: To provide a method and a device for producing a prepreg for a coreless substrate, whereby it is possible to obtain the prepreg for the coreless substrate having excellent workability, and having excellent thickness accuracy and dimensional stability; the prepreg for the coreless substrate obtained by a production method; and the coreless substrate using the prepreg for the coreless substrate, and the method for producing the coreless substrate.;SOLUTION: A method for producing a prepreg for a coreless substrate includes a step of attaching a resin film (I) containing a thermosetting resin composition to at least one surface of a sheet-like aggregate. Attachment is performed by a film pressure-welding step of pressure-welding, under a normal pressure, the resin film (I) to at least one surface of the sheet-like aggregate. There is also provided a device for producing the prepreg for the coreless substrate. There are further provided the prepreg for the coreless substrate obtained by a production method; and the coreless substrate using the prepreg for the coreless substrate, and the method of producing the coreless substrate.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2019,JPO&INPIT
机译:解决的问题:提供一种用于无芯基板的预浸料的制造方法和装置,由此可以得到加工性优异,厚度精度和尺寸稳定性优异的无芯基板的预浸料。通过生产方法获得的用于无芯基板的预浸料;解决方案:一种用于无芯基板的预浸料的制造方法包括以下步骤:附着包含热固性树脂组合物的树脂膜(I)的步骤。在片状聚集体的至少一个表面上。通过在常压下将树脂膜(I)压接至片状集合体的至少一个表面的膜压接步骤进行附接。还提供了一种用于生产无芯基板的预浸料的装置。还提供了通过生产方法获得的用于无芯基板的预浸料; ;无芯基体;使用无芯基体的预浸料的无芯基体;以及无芯基体的制造方法。;选图:图1;版权:(C)2019,JPO&INPIT

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