Pb-FREE Bi SOLDER ALLOY, ELECTRONIC COMPONENT PREPARED WITH THE SAME, AND ELECTRONIC COMPONENT-MOUNTING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a Pb-free Bi solder alloy that can form a solder joint with sufficient joining strength, even when used for joining to a joined member containing an Au layer as the outermost surface layer and an Ni layer as a ground layer.;SOLUTION: The present invention provides a Pb-free Bi solder alloy that contains Bi as a main component, and contains Ag of 0.1 mass% or more and 11.0 mass% or less and Sn of 3.0 mass% or more and 30.0 mass% or less, with the balance being Bi except inevitable impurities.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2018,JPO&INPIT