POWER GAIN (POWER SUPPLY) IN MUTUAL CONNECTION STRUCTURE AND BUILT-IN COMPONENT OF INTERPOSER SUBSTRATE IMPROVING POWER LOSS (POWER CONSUMPTION)

摘要

PROBLEM TO BE SOLVED: To provide a built-in component of interposer substrate improving a concern of power loss caused by a distance (length) of a capacitance up to a terminal block of an IC which is an object for mounting an electrical component, in mounting the electrical component on a rear face and/or a surface of a printed circuit board.SOLUTION: A power adjustment component 5 is mounted directly inside an adapter board 10 for built-in and the board 10 is then connected with a main circuit board 15. The adapter board 10 is connected with the main circuit board 15 by use of a method such as soldering, a conductive elastomer.SELECTED DRAWING: Figure 1