首页> 外国专利> EMBEDDED COMPONENTS IN INTERPOSER BOARD FOR IMPROVING POWER GAIN (DISTRIBUTION) AND POWER LOSS (DISSIPATION) IN INTERCONNECT CONFIGURATION

EMBEDDED COMPONENTS IN INTERPOSER BOARD FOR IMPROVING POWER GAIN (DISTRIBUTION) AND POWER LOSS (DISSIPATION) IN INTERCONNECT CONFIGURATION

机译:内插板中的嵌入式组件,用于改善互连配置中的功率增益(分配)和功率损耗(损耗)

摘要

THE PRESENT DISCLOSURE PROVIDES FOR ATTACHING AND EMBEDDING A CAPACITANCE OR A RESISTANCE DIRECTLY IN AN ADAPTOR BOARD OR AN INTERPOSER BOARD THAT IS THEN CONNECTED TO THE MAIN CIRCUIT BOARD. THE ADAPTOR BOARD CAN BE CONNECTED TO THE MAIN CIRCUIT BOARD BY SOLDERING, ELECTRICALLY CONNECTING IT BY A CONDUCTIVE ELASTOMER CONNECTION, SPRING PINS OR BY ANY OTHER WAY THAT IS KNOWN IN THE ART. THE MOST ILLUSTRATIVE DRAWING IS FIGURE 1
机译:当前的公开内容在于直接在连接到主电路板上的适配器板或插入板中连接和嵌入电容或电阻。可以通过导电的弹性连接,弹簧销或现有技术中已知的任何其他方式进行焊接,电气连接,从而将适配器板连接到主电路板上。最具说明性的图是图1

著录项

  • 公开/公告号MY165331A

    专利类型

  • 公开/公告日2018-03-21

    原文格式PDF

  • 申请/专利权人 R&D CIRCUITS INC;

    申请/专利号MY2012PI01174

  • 发明设计人 RUSSELL JAMES V.;

    申请日2010-01-08

  • 分类号H05K1/18;H01L23/32;H05K3/30;

  • 国家 MY

  • 入库时间 2022-08-21 12:49:34

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