首页> 外国专利> RESIN SPRAYING METHOD, RESIN SEALING METHOD OF RESIN SEALED COMPONENT, RESIN SPRAYING DEVICE, RESIN SEALING DEVICE OF RESIN SEALED COMPONENT, AND DEVICE FOR MANUFACTURING RESIN SEAL MOLDING

RESIN SPRAYING METHOD, RESIN SEALING METHOD OF RESIN SEALED COMPONENT, RESIN SPRAYING DEVICE, RESIN SEALING DEVICE OF RESIN SEALED COMPONENT, AND DEVICE FOR MANUFACTURING RESIN SEAL MOLDING

机译:树脂喷涂方法,树脂密封部件的树脂密封方法,树脂喷涂装置,树脂密封部件的树脂密封装置以及制造树脂密封件的装置

摘要

PROBLEM TO BE SOLVED: To provide a resin spraying method capable of supplying resin uniformly and quantitatively on a large-sized circular region.SOLUTION: A resin spraying method of the present invention is a method for spraying resin in a substantially circular resin spraying region (inside a frame 12) on a release film 11. In the resin spraying method, the resin is sprayed by moving a drop point of the resin in a direction substantially matching the circumferential direction of the resin spraying region (for example, along a trajectory 102) while the resin is dropped on the resin spraying region.SELECTED DRAWING: Figure 3
机译:解决的问题:提供一种能够在大尺寸的圆形区域上均匀且定量地供给树脂的树脂喷涂方法。解决方案:本发明的树脂喷涂方法是在大致圆形的树脂喷涂区域内喷涂树脂的方法。在框架12内)在释放膜11上。在树脂喷涂方法中,通过使树脂的滴落点沿与树脂喷涂区域的圆周方向基本匹配的方向(例如,沿着轨迹102)移动来喷涂树脂。 ),同时将树脂滴在树脂喷涂区域上。图3

著录项

  • 公开/公告号JP2018085540A

    专利类型

  • 公开/公告日2018-05-31

    原文格式PDF

  • 申请/专利权人 TOWA CORP;

    申请/专利号JP20180012956

  • 申请日2018-01-29

  • 分类号H01L21/56;B29C31/04;B29C33/68;

  • 国家 JP

  • 入库时间 2022-08-21 13:12:05

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号