首页> 外国专利> Cutting device of film, cutting method of release film, cutting method of film, resin sealing device of resin-encapsulated component, resin sealing method of resin-encapsulated component, and resin-sealed molded product manufacturing device

Cutting device of film, cutting method of release film, cutting method of film, resin sealing device of resin-encapsulated component, resin sealing method of resin-encapsulated component, and resin-sealed molded product manufacturing device

机译:膜的切断装置,剥离膜的切断方法,膜的切断方法,树脂封装部件的树脂密封装置,树脂封装部件的树脂密封方法以及树脂密封成型品制造装置

摘要

PROBLEM TO BE SOLVED: To provide a film cutting device which can efficiently manufacture a large-size circular release film.SOLUTION: A film cutting device includes a rotation member 3, a rotation arm 7, and a cutter 9. The rotation member 3 and the cutter 9 are respectively connected directly or indirectly to one end of the rotation arm 7 and the other end of the rotation arm 7. The cutter 9 stabs a predetermined position of the film by moving the cutter 9 to a film surface, and passes inside the rotation member 3, and the rotation member 3 rotates around a rotation axis approximately vertical to a film surface. Thereby, the cutter 9 stabbed on the film and the rotation arm 7 rotates to cut the film in a circular shape.
机译:解决的问题:提供一种能够有效地制造大尺寸的圆形离型膜的膜切割装置。解决方案:膜切割装置包括旋转构件3,旋转臂7和切割器9。旋转构件3和切割器9分别直接或间接地连接到旋转臂7的一端和旋转臂7的另一端。切割器9通过将切割器9移动到胶片表面而刺穿胶片的预定位置,并在内部通过。旋转构件3,旋转构件3绕大致垂直于膜表面的旋转轴旋转。由此,被刺在胶片上的切割器9和旋转臂7旋转以将胶片切割成圆形。

著录项

  • 公开/公告号JP6257320B2

    专利类型

  • 公开/公告日2018-01-10

    原文格式PDF

  • 申请/专利权人 TOWA株式会社;

    申请/专利号JP20130270429

  • 发明设计人 尾張 弘樹;高田 準子;

    申请日2013-12-26

  • 分类号B26D3/10;H01L21/56;B29C39/18;B29C39/24;

  • 国家 JP

  • 入库时间 2022-08-21 13:06:37

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