TOWA Makes Foray into Resin Sealing Devices Market

摘要

TOWA Corporation has clinched an exclusive contract with Robert Bosch GmbH to directly supply resin sealing devices for automotive electronic components. The company plans to start delivery of the YPS resin sealing devices to Robert Bosch around October this year. Out of the agreement, TOWA expects sales of about 20 units worth about ¥3 billion (US$32 million) in the next five years.rnLast April, TOWA laid out its new medium-term management plan up to March 2012 called "Revitalize TOWA," on the occasion of its 30th anniversary.rnThe company has been applying its precision metal mold technology and sealing technology, which it has cultivated in semiconductor business, to the growing markets of light-emitting diodes (LEDs), automotive electronic components, solar cells, and so on.