首页> 外国专利> POLYIMIDE FILM FOR FLEXIBLE DEVICE, PRECURSOR THEREOF, AND POLYIMIDE FILM WITH FUNCTIONAL LAYERS

POLYIMIDE FILM FOR FLEXIBLE DEVICE, PRECURSOR THEREOF, AND POLYIMIDE FILM WITH FUNCTIONAL LAYERS

机译:用于柔性设备的聚酰亚胺薄膜,其前驱体以及具有功能层的聚酰亚胺薄膜

摘要

PROBLEM TO BE SOLVED: To provide a polyimide film for a flexible device substrate that is a resin substrate capable of replacing a glass substrate to mount functional layers on, has low linear expansion, excellent film formation properties and excellent heat resistance, and can be easily peeled from a support substrate.;SOLUTION: A polyimide film for a flexible device is used as a substrate for a flexible device, and contains 10 mol% or more of polyimide structural units represented by the general formula (1).;SELECTED DRAWING: None;COPYRIGHT: (C)2018,JPO&INPIT
机译:解决的问题:提供一种用于柔性器件基板的聚酰亚胺膜,该树脂膜是能够代替玻璃基板以在其上安装功能层的树脂基板,具有低的线性膨胀,优异的成膜性和优异的耐热性并且可以容易地制造。解决方案:用于柔性器件的聚酰亚胺膜用作柔性器件的衬底,并包含10 mol%或更多的由通式(1)表示的聚酰亚胺结构单元。无;版权:(C)2018,JPO&INPIT

著录项

  • 公开/公告号JP2018104525A

    专利类型

  • 公开/公告日2018-07-05

    原文格式PDF

  • 申请/专利权人 NIPPON STEEL & SUMIKIN CHEMICAL CO LTD;

    申请/专利号JP20160250801

  • 发明设计人 HIRAISHI KATSUFUMI;WANG HONGYUAN;

    申请日2016-12-26

  • 分类号C08J5/18;C08G73/10;B32B27/34;G02F1/1333;H01L51/50;H05B33/02;

  • 国家 JP

  • 入库时间 2022-08-21 13:11:29

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