CASE HAVING GROOVE FOR INDUCING HEAT TRANSFER MATERIAL FOR ARRANGING SUBSTRATE ON WHICH ELECTRONIC COMPONENTS BEING IMPLEMENTED

摘要

PROBLEM TO BE SOLVED: To efficiently use a heat transfer material filled between a substrate and a case while suppressing an amount of use in the substrate on which electronic components are implemented and the case accommodating the substrate.;SOLUTION: On a substrate arrangement surface 310 of a case body 300, when a substrate is arranged on the substrate arrangement surface 310, heat generating electronic components implemented on the substrate form a plurality of grooves 310d to be radial by combination with a heat generation center opposing portion of a heat spreader opposing section 310S among heat generating electronic component opposing portions that are a portion opposing an area portion to be projected onto a rear surface of the substrate being a center of radiation. The plurality of grooves 310d are adapted to be formed from an outer edge of the heat spreader opposing portion 310S. The substrate is adapted to be arranged on the substrate arrangement surface 310 via the heat spreader opposing portion 310S and a heat transfer material provided around it by induction.;SELECTED DRAWING: Figure 3;COPYRIGHT: (C)2018,JPO&INPIT