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Material for printed wiring board, manufacturing method of material for printed wiring board, manufacturing method of printed wiring board

机译:印刷线路板用材料,印刷线路板用材料的制造方法,印刷线路板的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a material for printed wiring board which allows for easy manufacturing of a printed wiring board while reducing the manufacturing cost more than conventional.SOLUTION: A long first metal layer 31 on both sides of a long support layer 2, a long second metal layer 32 peelable from the first metal layer 31, a long first insulation layer 51, and a long third metal layer 33 are formed, in this order, so as to be wound like a roll while being laminated and integrated. Both side edges of the first metal layer 31 and second metal layer 32 are arranged on the inside of both side edges of the support layer 2. Both side edges of the first insulation layer 51 are arranged on the outside of both side edges of first metal layer 31 and second metal layer 32.
机译:解决的问题:提供一种用于印刷线路板的材料,该材料能够比传统方式更容易地制造印刷线路板,同时降低制造成本。解决方案:在长支撑层2的两侧上形成长的第一金属层31从第一金属层31可剥离的长的第二金属层32,长的第一绝缘层51和长的第三金属层33以此顺序形成,以便在层叠和集成时像卷一样缠绕。第一金属层31和第二金属层32的两个侧边缘设置在支撑层2的两个侧边缘的内侧。第一绝缘层51的两个侧边缘设置在第一金属的两个侧边缘的外侧。层31和第二金属层32。

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