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Material for printed wiring board, manufacturing method of material for printed wiring board, manufacturing method of printed wiring board
Material for printed wiring board, manufacturing method of material for printed wiring board, manufacturing method of printed wiring board
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机译:印刷线路板用材料,印刷线路板用材料的制造方法,印刷线路板的制造方法
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摘要
PROBLEM TO BE SOLVED: To provide a material for printed wiring board which allows for easy manufacturing of a printed wiring board while reducing the manufacturing cost more than conventional.SOLUTION: A long first metal layer 31 on both sides of a long support layer 2, a long second metal layer 32 peelable from the first metal layer 31, a long first insulation layer 51, and a long third metal layer 33 are formed, in this order, so as to be wound like a roll while being laminated and integrated. Both side edges of the first metal layer 31 and second metal layer 32 are arranged on the inside of both side edges of the support layer 2. Both side edges of the first insulation layer 51 are arranged on the outside of both side edges of first metal layer 31 and second metal layer 32.
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