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Heat treatment apparatus, abnormality detection method in heat treatment, readable computer storage medium

机译:热处理装置,热处理中的异常检测方法,可读计算机存储介质

摘要

PROBLEM TO BE SOLVED: To detect abnormality in the heat treatment of a substrate accurately.SOLUTION: A heat treatment apparatus performing heat treatment of a wafer has: a heat plate 132 for mounting and heating a wafer W; a plurality of wafer support members 170 arranged to project above the mounting surface 132a of the heat plate 132; a weight sensor 184 for detecting a load which changes as the mounting state of the wafer W supported by the wafer support members 170 changes; and a control section 300 for determining that the mounting state of the wafer supported by the wafer support members 170 is abnormal, when the load detected by the weight sensor 184 goes below a predetermined threshold.SELECTED DRAWING: Figure 9
机译:解决的问题:为了准确地检测基板的热处理中的异常。解决方案:对晶片进行热处理的热处理设备具有:用于安装和加热晶片W的加热板132;多个晶片支撑构件170布置成在加热板132的安装表面132a上方突出。重量传感器184,用于检测随着晶片支撑部件170所支撑的晶片W的载置状态的变化而变化的负荷。当重量传感器184检测到的负载低于预定阈值时,控制部分300用于确定由晶片支撑部件170支撑的晶片的安装状态是否异常。图9

著录项

  • 公开/公告号JP6308967B2

    专利类型

  • 公开/公告日2018-04-11

    原文格式PDF

  • 申请/专利权人 東京エレクトロン株式会社;

    申请/专利号JP20150065784

  • 发明设计人 森 泰夫;七種 剛;

    申请日2015-03-27

  • 分类号H01L21/027;H01L21/683;

  • 国家 JP

  • 入库时间 2022-08-21 13:09:24

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