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Monolithic gas distribution manifold and its various construction techniques and applications

机译:整体式气体分配歧管及其各种施工技术和应用

摘要

A gas supply substrate for mounting a gas supply component of a gas supply system for a semiconductor processing apparatus is provided. The substrates are bonded together to form a major surface that forms a laminate with openings for receiving and attaching the first, second, third, and fourth gas supply components to the outer major surface. You may have multiple layers with it. The substrate may comprise a first gas channel extending to an inner major surface, the first gas channel overlapping at least partially with a second gas channel extending to a different inner major surface. The substrate includes a first gas conduit including a first gas channel connecting the first gas supply component to the second gas supply component, and a second connecting the third gas supply component to the fourth gas supply component. And a second gas conduit including a gas channel. Various techniques for manufacturing a gas supply substrate are also disclosed. [Selection] Figure 11
机译:提供一种用于安装半导体处理装置的气体供给系统的气体供给部件的气体供给基板。将基板粘合在一起以形成主表面,该主表面形成具有开口的层压板,该开口用于将第一,第二,第三和第四气体供应部件接收并将其附接到外部主表面。您可能具有多个层次。基底可以包括延伸到内主表面的第一气体通道,第一气体通道与延伸到不同的内主表面的第二气体通道至少部分重叠。基板包括第一气体导管,该第一气体导管包括将第一气体供应部件连接到第二气体供应部件的第一气体通道,以及将第三气体供应部件连接到第四气体供应部件的第二气体通道。第二气体导管包括气体通道。还公开了用于制造供气基板的各种技术。 [选择]图11

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