Multi-sided body of lead frame, multi-sided body of lead frame with resin, multi-sided body of semiconductor device

摘要

PROBLEM TO BE SOLVED: To provide a multi-piece body of a lead frame, a multi-piece body of a lead frame with resin, and a multi-piece body of a semiconductor device, enabling prevention of generation of metal powder from a rear surface of a frame body and an outer peripheral side surface.SOLUTION: In a multi-piece body MS of a lead frame 10, the lead frame 10 on a surface of which an LED element is connected is provided on a frame body F in multiple pieces. The frame body F includes a groove part D1 which is recessed from a rear surface, following at least one side among the sides forming a profile of it. It includes a frame body resin part 14 which is formed in the groove part D1 of the frame body F, being protruding from a rear surface of the frame body F.