Multi-sided body of lead frame, multi-sided body of lead frame with resin, multi-sided body of optical semiconductor device, lead frame, lead frame with resin, optical semiconductor device

摘要

PROBLEM TO BE SOLVED: To provide a multifaceted body of lead frame, a multifaceted body of lead frame with resin, a multifaceted body of optical semiconductor device, a lead frame, a lead frame with resin, and an optical semiconductor device which allows for enhancement of cutting efficiency.SOLUTION: A multifaceted body MS of lead frame includes a lead frame 10 multifaceted to a frame F, and used for an optical semiconductor device 1 to which an LED element 2 is connected. The frame F includes a first intermediate frame part F2, in a package region forming the outline of the optical semiconductor device 1.