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Film with transferred copper foil, method for producing copper foil laminated laminate, film intermediate with transferred copper foil

机译:带有转移铜箔的薄膜,生产铜箔层压层压板的方法,带有转移铜箔的薄膜中间体

摘要

PROBLEM TO BE SOLVED: To provide a film with a transfer copper foil, excellent in adhesion with a base material and capable of being easily produced.SOLUTION: A film with a transfer copper foil includes: an insulator film; a copper thin film layer formed on at least one face of the insulator film by a dry plating method; and a copper plated film formed on the copper thin film layer by an electric plating method and having one face facing the copper thin film layer and the other face disposed on the opposite side of the one face. The surface roughness (Ra) on the other face of the copper plated film is 0.03 μm or more and 0.26 μm or less, and the adhesion strength between the insulator film and a copper coated film layer having the copper thin film layer and the copper plated film is 100 N/m or more and 200 N/m or less.
机译:解决的问题:提供一种带有转印铜箔的膜,该膜与基材的粘合性优异,并且易于生产。通过干镀法在绝缘膜的至少一个面上形成铜薄膜层。通过电镀方法在铜薄膜层上形成的铜镀膜,其一个面向铜薄膜层的面和另一面位于该面的​​相反侧。镀铜膜的另一面上的表面粗糙度(Ra)为0.03μm以上且0.26μm以下,并且绝缘膜与具有铜薄膜层的铜覆膜层之间的密合强度。镀铜膜为100N / m以上200N / m以下。

著录项

  • 公开/公告号JP6349641B2

    专利类型

  • 公开/公告日2018-07-04

    原文格式PDF

  • 申请/专利权人 住友金属鉱山株式会社;

    申请/专利号JP20130159797

  • 发明设计人 永田 純一;

    申请日2013-07-31

  • 分类号H05K1/09;H05K3/38;B32B15/08;

  • 国家 JP

  • 入库时间 2022-08-21 13:08:07

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