首页>
外国专利>
Film with transferred copper foil, method for producing copper foil laminated laminate, film intermediate with transferred copper foil
Film with transferred copper foil, method for producing copper foil laminated laminate, film intermediate with transferred copper foil
展开▼
机译:带有转移铜箔的薄膜,生产铜箔层压层压板的方法,带有转移铜箔的薄膜中间体
展开▼
页面导航
摘要
著录项
相似文献
摘要
PROBLEM TO BE SOLVED: To provide a film with a transfer copper foil, excellent in adhesion with a base material and capable of being easily produced.SOLUTION: A film with a transfer copper foil includes: an insulator film; a copper thin film layer formed on at least one face of the insulator film by a dry plating method; and a copper plated film formed on the copper thin film layer by an electric plating method and having one face facing the copper thin film layer and the other face disposed on the opposite side of the one face. The surface roughness (Ra) on the other face of the copper plated film is 0.03 μm or more and 0.26 μm or less, and the adhesion strength between the insulator film and a copper coated film layer having the copper thin film layer and the copper plated film is 100 N/m or more and 200 N/m or less.
展开▼