The copper foil lamination film of 2 layer system which is produced with surface improvement method of the polyimide film which uses the ethylene imine coupling medicine, production method and its method of the copper foil lamination film which uses that

摘要

This invention regards the soft characteristic copper foil lamination film of 2 layer system which is produced with surface improvement method of the polyimide film, production method and its method of the soft characteristic copper foil lamination film which uses that.SolutionsSurface improvement method of the polyimide film of this invention the primary plasma can process on the polyimide film surface and can add the chemical compound 0.25 - 1 mols which are indicated in the chemical compound 1 mols which are indicated with chemical formula 1 with chemical formula 2 and can make the solution soak where the ethylene imine silane coupling medicine which is produced is contained and the surface can process and can be simplified from the finishing process due to the former ion beam and by consecutively administering secondary plasma processing can substitute and on the surface of the polyimide film which is improved at copper sputtering and electrolytic copper plated method the soft characteristic copper foil lamination film of 2 layer system which is produced is superior with the polyimide film and the copper foil, it gluesBecause strength and the bond strength which is superior even under long haul hot environment is maintained, it is utilized usefully for soft printed circuit baseplate or as a baseplate material of the electronic part of TCP and COF etc.