Method for manufacturing resin-molded mold and resin molded part of electronic component

摘要

The invention provides a resin sealing mold, the mold can effective exhaust air to outside from the molten resin-injected cavity, and a deburring machine is well used to remove the burr of an intermediate product. In the resin sealing mold, the cavity (60) is formed through the lower side cavity (25) arranged in a lower side cavity block and the upper side cavity (35) arranged in an upper side cavity block (33). A dam block (27) is arranged on the upper surface (23a) of the lower side cavity block along the opening edge of the lower side cavity (35), the dam block (27) is configurated in an un-abutted way with the upper surface of a lead frame when the lead frame is clamped, an exhaust port (36) is arranged on the lower surface (33a) of the upper side cavity block (33), is separated with the upper side cavity (35) and is communicated with the outside. The height of the dam block (27) is less than the thickness of the lead frame (40). When the lead frame is clamped, the exhaust port (36) and the dam block (27) are partly overlapped.