Film-like adhesive and dicing tape with film adhesive

摘要

PROBLEM TO BE SOLVED: To provide a film adhesive capable of enhancing adhesion force to a metal layer to prevent chip loss, and a dicing tape with the film adhesive.SOLUTION: The present invention relates to a film adhesive which has adhesive force of 0.2 N/10 mm or more to a test wafer comprising a wafer, a titanium film arranged on the wafer, a nickel film arranged on the titanium film, and a silver film arranged on the nickel film.