Power module board, power module circuit board and power module

摘要

The power module substrate (100) of the present invention includes a metal substrate (101), an insulating resin layer (102) provided on the metal substrate (101), and a metal layer provided on the insulating resin layer (102). (103). The insulating resin layer (102) includes a thermosetting resin (A) and an inorganic filler (B) dispersed in the thermosetting resin (A), and an insulating resin at a frequency of 1 kHz and 100 ° C. to 175 ° C. The maximum value of the dielectric loss factor of the layer (102) is 0.030 or less, and the change in relative dielectric constant is 0.10 or less.