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Micromachined monolithic 3-axis gyroscope with single drive

机译:单驱动微加工单片三轴陀螺仪

摘要

This document discusses, among other things, a cap wafer and a via wafer configured to encapsulate a single proof-mass 3-axis gyroscope formed in an x-y plane of a device layer. The single proof-mass 3-axis gyroscope can include a main proof-mass section suspended about a single, central anchor, the main proof-mass section including a radial portion extending outward towards an edge of the 3-axis gyroscope sensor, a central suspension system configured to suspend the 3-axis gyroscope from the single, central anchor, and a drive electrode including a moving portion and a stationary portion, the moving portion coupled to the radial portion, wherein the drive electrode and the central suspension system are configured to oscillate the 3-axis gyroscope about a z-axis normal to the x-y plane at a drive frequency.
机译:该文件尤其讨论了盖晶片和通孔晶片,该晶片被配置为封装形成在器件层的x-y平面中的单个质量块3轴陀螺仪。单质量块三轴陀螺仪可包括围绕单个中央锚固件悬挂的主质量块段,该主质量块段包括朝向三轴陀螺仪传感器的边缘向外延伸的径向部分,悬挂系统,其配置为将3轴陀螺仪悬挂在单个中央锚固件和驱动电极上,该驱动电极包括移动部分和固定部分,该移动部分连接到径向部分,其中,驱动电极和中央悬挂系统配置为使三轴陀螺仪以垂直于xy平面的z轴以驱动频率振荡。

著录项

  • 公开/公告号US10050155B2

    专利类型

  • 公开/公告日2018-08-14

    原文格式PDF

  • 申请/专利权人 FAIRCHILD SEMICONDUCTOR CORPORATION;

    申请/专利号US201615005783

  • 发明设计人 CENK ACAR;

    申请日2016-01-25

  • 分类号G01P21/02;H01L29/84;G01C19/5755;G01P15/125;G01P15/18;B81B7/04;G01P15/08;

  • 国家 US

  • 入库时间 2022-08-21 13:05:13

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