Power-ground co-reference transceiver structure to deliver ultra-low crosstalk

摘要

An interface layout for a vertical interface of a first semiconductor component is disclosed. A first one or more conductors configured to carry power signals extends vertically from the first semiconductor component. A second one or more conductors configured to carry data signals extends vertically from the first semiconductor component. A third one or more conductors configured to carry ground signals extending vertically from the first semiconductor component. The first one or more conductors are further configured to shield and separate the second one or more conductors. A fourth one or more conductors extends horizontally from the first one or more conductors adjacent to and terminating proximal to the third one or more conductors. A fifth one or more conductors extending horizontally from the third one or more conductors adjacent to and terminating proximal to the first one or more conductors and the fourth one or more conductors. The fourth one or more conductors and the corresponding adjacent fifth one or more conductors form a plate capacitor.