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Thin-slice manufacturing device and thin-slice manufacturing method

机译:薄板制造装置及薄板制造方法

摘要

A thin-slice manufacturing device is a thin-slice manufacturing device for cutting an embedding block in which a biological sample is embedded by paraffin using a cutting blade relatively moved with respect to the embedding block along a virtual plane to cut out thin slices, the thin-slice manufacturing device includes a vertical illumination part configured to radiate light to the embedding block, and an inclination estimation part configured to detect a boundary line between a cutting surface cut along the virtual plane and a non-cutting surface based on reflection of light generated by the light radiated to the embedding block by the vertical illumination part, and estimate inclination information showing information related to inclination of the embedding block based on the detected boundary line.
机译:薄片制造设备是用于切割包埋块的薄片制造设备,其中使用相对于包埋块沿虚拟平面相对移动的切割刀片通过石蜡将生物样品包埋在其中,以切出薄片。薄板制造装置包括:垂直照明部,其配置为向嵌入块照射光;倾斜度估计部,其配置为基于光的反射来检测沿着虚拟面切割的切割面与非切割面之间的边界线。通过由垂直照明部分辐射到嵌入块的光产生的光,并基于检测到的边界线估计表示与嵌入块的倾斜度有关的信息的倾斜度信息。

著录项

  • 公开/公告号US10018535B2

    专利类型

  • 公开/公告日2018-07-10

    原文格式PDF

  • 申请/专利权人 SAKURA FINETEK JAPAN CO. LTD.;

    申请/专利号US201414897944

  • 发明设计人 TATSUYA MIYATANI;

    申请日2014-06-26

  • 分类号G01N1/06;G01N1/36;

  • 国家 US

  • 入库时间 2022-08-21 13:03:46

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