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Test board unit and apparatus for testing a semiconductor chip including the same

机译:测试板单元以及用于测试包括该测试板单元的半导体芯片的设备

摘要

A test board unit may include a test board, a thermal tank and a heat-dissipating plate. The test board may be configured to provide a semiconductor chip with a test current. The thermal tank may be configured to dissipate heat generated in the semiconductor chip. The heat-dissipating plate may be coupled between the test board and the thermal tank and may be configured to transfer the heat from the semiconductor chip to the thermal tank.
机译:测试板单元可以包括测试板,热箱和散热板。测试板可以被配置为向半导体芯片提供测试电流。所述热罐可以被配置为散发在所述半导体芯片中产生的热量。散热板可以被耦合在测试板和热箱之间,并且可以被配置为将热量从半导体芯片传递到热箱。

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