TEST SOCKET FOR TESTING SEMICONDUCTOR CHIP AND TEST APPARATUS INCLUDING THE SAME, METHOD FOR TESTING THE SEMICONDUCTOR CHIP

摘要

A test socket for testing a semiconductor package, a test apparatus including the same, a method for testing the semiconductor package are provided to reduce the time for exchanging the test socket when the ball pitch of the semiconductor package is changed. A test socket mounted on a test board to test performance of a semiconductor package includes a base for receiving the semiconductor package, and a contact sheet fixed to the base. The contact sheet includes a plurality of contact terminals which come in contact with the terminals formed on the semiconductor package and is inserted into an insertion slot formed on one side of the base. The base includes a body(210) fixed to the test board and an adaptor(220) coupled with the upper part of the body to fix the contact sheet.