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Various stress free sensor packages using wafer level supporting die and air gap technique
Various stress free sensor packages using wafer level supporting die and air gap technique
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机译:使用晶圆级支撑芯片和气隙技术的各种无应力传感器封装
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摘要
Sensor packages and manners of formation are described. In an embodiment, a sensor package includes a supporting die characterized by a recess area and a support anchor protruding above the recess area. A sensor die is bonded to the support anchor such that an air gap exists between the sensor die and the recess area. The sensor die includes a sensor positioned directly above the air gap.
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