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GaN-based power electronic device and method for manufacturing the same

机译:GaN基功率电子器件及其制造方法

摘要

A GaN-based power electronic device and a method for manufacturing the same is provided. The GaN-based power electronic device comprising a substrate and an epitaxial layer over the substrate. The epitaxial layer comprises a GaN-based heterostructure layer, a superlattice structure layer and a P-type cap layer. The superlattice structure layer is provided over the heterostructure layer, and the P-type cap layer is provided over the superlattice structure layer. By using this electronic device, gate voltage swing and safe gate voltage range of the GaN-based power electronic device manufactured on the basis of the P-type cap layer technique may be further extended, and dynamic characteristics of the device may be improved. Therefore, application process for the GaN-based power electronic device that is based on the P-type cap layer technique will be promoted.
机译:提供了一种基于GaN的功率电子器件及其制造方法。所述基于GaN的功率电子器件包括衬底和在所述衬底上方的外延层。外延层包括GaN基异质结构层,超晶格结构层和P型盖层。超晶格结构层设置在异质结构层上方,P型盖层设置在超晶格结构层上方。通过使用该电子器件,可以进一步扩展基于P型盖层技术制造的GaN基功率电子器件的栅极电压摆幅和安全栅极电压范围,并且可以改善器件的动态特性。因此,将促进基于P型盖层技术的GaN基电力电子器件的应用工艺。

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