首页>
外国专利>
HYBRID EMBEDDED SURFACE MOUNT MODULE FORM FACTOR WITH SAME SIGNAL SOURCE SUBSET MAPPING
HYBRID EMBEDDED SURFACE MOUNT MODULE FORM FACTOR WITH SAME SIGNAL SOURCE SUBSET MAPPING
展开▼
机译:具有相同信号源子集映射的混合嵌入式表面安装模块形式因子
展开▼
页面导航
摘要
著录项
相似文献
摘要
A surface mount module form factor comprises a substrate having a bottom surface, a top surface, and an outer periphery, with at least one electronic component mounted on the substrate, and a plurality of land grid array pads mounted on the bottom surface of the substrate. At least some of the land grid array pads are coupled to the at least one electronic component. A plurality of castellated edge pads are mounted around the outer periphery of the substrate, with at least some of the castellated edge pads coupled to the at least one electronic component. At least some of the land grid array pads are mapped to at least some of the castellated edge pads.
展开▼