首页> 外国专利> GAS FILLED SUBSEA ELECTRONICS HOUSING WITH SPRING ENGAGED HEAT SINK

GAS FILLED SUBSEA ELECTRONICS HOUSING WITH SPRING ENGAGED HEAT SINK

机译:弹簧接合式散热片的充气式SUSBEA电子外壳

摘要

Heat sinks that cool electronics are mounted within a subsea housing or vessel. Springs are used to provide pressure between the heat sinks and a vessel wall. Vessel wall deformation caused by external seawater pressure is absorbed by the springs, which maintain a pre-load force according to the spring characteristics. The mechanism also allows for rack mounting of the electronics without the need for manual access in the relatively compact vessel or housing.
机译:用于冷却电子设备的散热器安装在海底外壳或船只内。弹簧用于在散热器和容器壁之间提供压力。由外部海水压力引起的容器壁变形被弹簧吸收,弹簧根据弹簧特性保持预紧力。该机构还允许在相对紧凑的容器或壳体中手动安装电子设备而无需手动操作。

著录项

  • 公开/公告号US2018123328A1

    专利类型

  • 公开/公告日2018-05-03

    原文格式PDF

  • 申请/专利权人 ONESUBSEA IP UK LIMITED;

    申请/专利号US201715798279

  • 申请日2017-10-30

  • 分类号H02B1/56;H02B1/28;H05K7/20;H02B3;H02B1/46;

  • 国家 US

  • 入库时间 2022-08-21 13:01:52

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