首页> 外国专利> Solid electrolytic capacitor package structure for increasing electrical performances and method of manufacturing the same, and capacitor unit thereof

Solid electrolytic capacitor package structure for increasing electrical performances and method of manufacturing the same, and capacitor unit thereof

机译:用于提高电性能的固体电解电容器封装结构及其制造方法以及电容器单元

摘要

The present disclosure provides a solid electrolytic capacitor package structure for increasing electrical performances and a method of manufacturing the same, and a capacitor unit thereof. The capacitor unit includes at least one first capacitor, the at least one first capacitor includes a conductive polymer composite material layer. The conductive polymer composite material layer includes a conductive polymer material and a first nanometer material mixed with the conductive polymer material, and the first nanometer material includes a plurality of first fully embedded nanometer structures completely enclosed by the conductive polymer material and a plurality of first partially exposed nanometer structures partially exposed from the conductive polymer material.
机译:本公开提供了一种用于提高电性能的固体电解电容器封装结构及其制造方法,以及其电容器单元。电容器单元包括至少一个第一电容器,该至少一个第一电容器包括导电聚合物复合材料层。导电聚合物复合材料层包括导电聚合物材料和与导电聚合物材料混合的第一纳米材料,并且第一纳米材料包括被导电聚合物材料完全包围的多个第一完全嵌入纳米结构以及多个第一部分从导电聚合物材料部分暴露的暴露的纳米结构。

著录项

  • 公开/公告号US10068711B2

    专利类型

  • 公开/公告日2018-09-04

    原文格式PDF

  • 申请/专利权人 APAQ TECHNOLOGY CO. LTD.;

    申请/专利号US201715602183

  • 发明设计人 MING-TSUNG CHEN;CHIEH LIN;

    申请日2017-05-23

  • 分类号H01G9;H01G9/08;H01G9/26;H01G9/012;H01G9/025;

  • 国家 US

  • 入库时间 2022-08-21 13:01:42

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