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Semiconductor Device Including an LDMOS Transistor and a Resurf Structure

机译:包括LDMOS晶体管和Resurf结构的半导体器件

摘要

In an embodiment, a high frequency amplifying circuit includes a semiconductor device. The semiconductor device includes a semiconductor substrate having a bulk resistivity ρ≧100 Ohm·cm, a front surface and a rear surface, an LDMOS (Lateral Diffused Metal Oxide Semiconductor) transistor in the semiconductor substrate, and a RESURF structure comprising a doped buried layer arranged in the semiconductor substrate, spaced at a distance from the front surface and the rear surface, and coupled with at least one of a channel region and a body contact region of the LDMOS transistor.
机译:在一个实施例中,高频放大电路包括半导体器件。该半导体器件包括:半导体衬底,其体电阻率ρ≥100Ohm·cm;正面和背面;半导体衬底中的LDMOS(横向扩散金属氧化物半导体)晶体管;以及RESURF结构,其包括掺杂掩埋层半导体器件布置在半导体衬底中,与前表面和后表面隔开一定距离,并与LDMOS晶体管的沟道区和体接触区中的至少一个耦合。

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