首页> 外国专利> Elevationally-Extending String Of Memory Cells And Methods Of Forming An Elevationally-Extending String Of Memory Cells

Elevationally-Extending String Of Memory Cells And Methods Of Forming An Elevationally-Extending String Of Memory Cells

机译:高扩展性的存储单元串和形成高扩展性的存储单元串的方法

摘要

A method that is part of a method of forming an elevationally-extending string of memory cells comprises forming an intervening structure that is elevationally between upper and lower stacks that respectively comprise alternating tiers comprising different composition materials. The intervening structure is formed to comprise an elevationally-extending-dopant-diffusion barrier and laterally-central material that is laterally inward of the dopant-diffusion barrier and has dopant therein. Some of the dopant is thermally diffused from the laterally-central material into upper-stack-channel material. The dopant-diffusion barrier during the thermally diffusing is used to cause more thermal diffusion of said dopant into the upper-stack-channel material than diffusion of said dopant, if any, into lower-stack-channel material. Other embodiments, including structure independent of method, are disclosed.
机译:作为形成存储器单元的高度延伸的串的方法的一部分的一种方法,包括形成居间结构,该居间结构在上部和下部叠层之间是纵向的,所述上部叠层和下部叠层分别包括具有不同组成材料的交替层。中间结构形成为包括高度延伸的掺杂剂扩散阻挡层和横向中心的材料,该材料在掺杂剂扩散阻挡层的横向内侧并且在其中具有掺杂剂。一些掺杂剂从横向中心材料热扩散到上部堆叠通道材料中。在热扩散过程中,掺杂剂扩散阻挡层用于使所述掺杂剂向上部堆叠通道材料的热扩散比使所述掺杂剂向下部堆叠通道材料的扩散(如果有的话)更多。公开了包括与方法无关的结构的其他实施例。

著录项

  • 公开/公告号US2018308858A1

    专利类型

  • 公开/公告日2018-10-25

    原文格式PDF

  • 申请/专利权人 MICRON TECHNOLOGY INC.;

    申请/专利号US201715494969

  • 发明设计人 JOHN D. HOPKINS;DAVID DAYCOCK;

    申请日2017-04-24

  • 分类号H01L27/11582;H01L27/11524;H01L27/11556;H01L27/1157;H01L29/10;H01L21/225;

  • 国家 US

  • 入库时间 2022-08-21 12:59:39

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