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PACKAGE PROCESS METHOD INCLUDING DISPOSING A DIE WITHIN A RECESS OF A ONE-PIECE MATERIAL
PACKAGE PROCESS METHOD INCLUDING DISPOSING A DIE WITHIN A RECESS OF A ONE-PIECE MATERIAL
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机译:包括在一片材料中重新放置模具的封装工艺方法
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摘要
A package structure may include a one-piece metal carrier, a die, a mold layer and a redistribution layer. The one-piece metal carrier may include a bottom portion and a first supporting structure, and the one-piece metal carrier may have a recess defined by the bottom portion and the first supporting structure. The die may be disposed in the recess of the one-piece metal carrier, and the die may have a plurality of conductive bumps. The mold layer may be formed to encapsulate the die. The mold layer may expose a portion of each of the plurality of conductive bumps and a portion of the first supporting structure. The redistribution layer may be disposed on the mold layer and electrically connected to the plurality of conductive bumps.
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