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Solid source doping for source and drain extension doping

机译:固体源极掺杂,用于源极和漏极扩展掺杂

摘要

A method is provided for solid source doping for source and drain extensions. According to one embodiment, the method includes providing a substrate containing fins of first and second film stacks, sacrificial gates across and on the fins of the first and second film stacks, where the first and second film stacks include alternating first and second films, and where the first films extend through sidewall spacers on the sacrificial gates, selectively forming a first mask layer on the sidewall spacers and on the first films of the first film stack, depositing a first dopant layer on the substrate, heat-treating the substrate to diffuse dopants from the first dopant layer into the first films of the second film stack to form doped first films in the second film stack, and removing the first mask layer from the substrate. The processing steps may be repeated for the second film stack.
机译:提供了一种用于源极和漏极扩展的固体源极掺杂的方法。根据一个实施例,该方法包括提供衬底,该衬底包含第一膜叠层和第二膜叠层的鳍,在第一膜叠层和第二膜叠层的鳍之上和之上的牺牲栅,其中第一膜叠层和第二膜叠层包括交替的第一膜和第二膜,以及其中第一膜延伸穿过牺牲栅极上的侧壁间隔物,在侧壁间隔物和第一膜堆叠的第一膜上选择性地形成第一掩模层,在衬底上沉积第一掺杂剂层,对衬底进行热处理以扩散从第一掺杂剂层向第二膜堆叠的第一膜中注入第一掺杂剂,以在第二膜堆叠中形成掺杂的第一膜,并从基板上去除第一掩模层。可以针对第二膜堆叠重复处理步骤。

著录项

  • 公开/公告号US9978649B2

    专利类型

  • 公开/公告日2018-05-22

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LIMITED;

    申请/专利号US201715465311

  • 申请日2017-03-21

  • 分类号H01L21/8238;H01L29/78;H01L29/66;H01L21/225;H01L21/324;H01L21/033;H01L27/092;H01L29/161;H01L29/167;

  • 国家 US

  • 入库时间 2022-08-21 12:58:03

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