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Paste for joining components of electronic modules, system and method for applying the paste
Paste for joining components of electronic modules, system and method for applying the paste
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机译:用于连接电子模块组件的焊膏,施加焊膏的系统和方法
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摘要
The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder powder and metal powder before a first heating. According to the invention, the binder is free of flux or is a flux having only low activation. In this way, a joining layer which exhibits only few included voids and good mechanical and electrical stability can be provided between a first and a second component.
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