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Thermal interface material layer and package-on-package device including the same
Thermal interface material layer and package-on-package device including the same
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机译:热界面材料层和包括该热界面材料层的层叠封装装置
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摘要
Provided are a thermal interface material layer and a package-on-package device including the same. The package-on-package device may include a thermal interface material layer interposed between lower and upper semiconductor packages and configured to have a specific physical property. Accordingly, it is possible to prevent a crack from occurring in a lower semiconductor chip, when a solder ball joint process is performed to mount the upper semiconductor package on the lower semiconductor package.
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