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Systems and methods for high-speed, low-profile memory packages and pinout designs
Systems and methods for high-speed, low-profile memory packages and pinout designs
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机译:高速,薄型存储器封装和引脚设计的系统和方法
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摘要
Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.
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