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Integrated structures of acoustic wave device and varactor, and acoustic wave device, varactor and power amplifier, and fabrication methods thereof

机译:声波器件和变容二极管的集成结构,声波器件,变容二极管和功率放大器及其制造方法

摘要

An integrated structure of acoustic wave device and varactor comprises an acoustic wave device and a varactor formed on a first part and a second part of a semiconductor substrate respectively. The acoustic wave device comprises an acoustic wave device upper structure and a first part of a bottom epitaxial structure. The acoustic wave device upper structure is formed on the first part of the bottom epitaxial structure. The varactor comprises a varactor upper structure and a second part of the bottom epitaxial structure. The varactor upper structure is formed on the second part of the bottom epitaxial structure. The integrated structure of the acoustic wave device and the varactor formed on the same semiconductor substrate is capable of reducing the module size, optimizing the impedance matching, and reducing the signal loss between the varactor and the acoustic wave device.
机译:声波器件和变容二极管的集成结构包括分别形成在半导体衬底的第一部分和第二部分上的声波器件和变容二极管。声波器件包括声波器件的上部结构和底部外延结构的第一部分。声波器件的上部结构形成在底部外延结构的第一部分上。变容二极管包括变容二极管上部结构和底部外延结构的第二部分。变容二极管上部结构形成在底部外延结构的第二部分上。声波器件和变容二极管在同一半导体衬底上形成的集成结构能够减小模块尺寸,优化阻抗匹配,并减小变容二极管和声波器件之间的信号损耗。

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