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Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications

机译:用于高质量(Q)因子射频(RF)应用的增强型电容器结构

摘要

An augmented capacitor structure includes a substrate and a first capacitor plate of a first conductive layer on the substrate. The augmented capacitor structure also includes an insulator layer on a surface of the first capacitor plate facing away from the substrate and a second capacitor plate. The second capacitor plate includes a second conductive layer on the insulator layer, supported by the first capacitor plate as a first capacitor. A second capacitor electrically is coupled in series with the first capacitor. The first capacitor plate is shared by the first capacitor and the second capacitor as a shared first capacitor plate. An extended first capacitor plate includes a first dummy portion of a third conductive layer and a first dummy via bar extending along the surface of the shared first capacitor plate. The first dummy portion extends along and is supported by the first dummy via bar.
机译:增强型电容器结构包括基板和在基板上的第一导电层的第一电容器板。增强电容器结构还包括在第一电容器板的背向基板的表面上的绝缘体层和第二电容器板。第二电容器板包括在绝缘体层上的第二导电层,由第一电容器板作为第一电容器支撑。第二电容器与第一电容器串联电耦合。第一电容器板被第一电容器和第二电容器共享,作为共享的第一电容器板。延伸的第一电容器板包括第三导电层的第一虚拟部分和沿着共用的第一电容器板的表面延伸的第一虚拟通路棒。第一虚设部分沿着第一虚设通孔杆延伸并由其支撑。

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