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PRODUCING OXIDIC COMPOUNDS ON N-GASB SURFACE

机译:在N-GASB表面上生产氧化性化合物

摘要

The invention relates to a process of passivation of n-GaSb surface (100) used as a substrate in electronic device manufacturing. According to the invention, the process consists in chemically treating the n-GaSb surface, which was previously cleaned in trichloroethylene solvent, with corrosive HF and HCl solutions, after which the surface free of native oxides is subjected to a chemical treatment by oxidation in water vapour flow, at a temperature of 100°C, for 4 h, on thermostated heating plate, at a temperature of 60°C, for 3 h, resulting in a layer of oxidic complex GaOand SbOof 16.4 ± 0.3 nm and then, under incandescence lamp of 100...150 W, for 400...450 h, to result in an oxidic complex layer of 8.6 ± 0.1 nm, the n-GaSb surface being possibly subjected to anodic oxidation in a solution of citric acid, ethylene glycol and deionized water, at a pH value of 2.35, anodic voltage of 1...30 V, a current 1 mA, for 40 s, wherefrom a preponderant gallium oxide layer is obtained on the n-GaSb surface (100).
机译:本发明涉及在电子设备制造中用作衬底的n-GaSb表面(100)的钝化方法。根据本发明,该方法包括用腐蚀性的HF和HCl溶液化学处理预先在三氯乙烯溶剂中清洗过的n-GaSb表面,然后通过在水中的氧化对不含天然氧化物的表面进行化学处理。在恒温加热板上在100°C的温度下蒸汽流4小时,在60°C的温度下蒸汽流3小时,形成一层16.4±0.3 nm的氧化络合物GaO和SbO,然后在白炽灯下灯100 ... 150 W,持续400 ... 450 h,产生8.6±0.1 nm的氧化复合层,n-GaSb表面可能在柠檬酸,乙二醇溶液中进行阳极氧化在pH值为2.35的去离子水中,阳极电压为1 ... 30 V,电流<1 mA,持续40 s,从而在n-GaSb表面(100)上获得了优越的氧化镓层。

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