首页> 外国专利> CAPACITOR STRUCTURE FOR NON-VOLATILE MEMORY, BASED ON GERMANIUM NANOCRYSTALS IMMERSED IN SILICON DIOXIDE

CAPACITOR STRUCTURE FOR NON-VOLATILE MEMORY, BASED ON GERMANIUM NANOCRYSTALS IMMERSED IN SILICON DIOXIDE

机译:基于浸渍在二氧化硅中的锗纳米晶的非挥发性记忆体电容器结构

摘要

The invention relates to a capacitor structure for a non-volatile memory, based on Ge nanocrystals immersed in SiOand to a process for preparing the same, said structure being meant to be used in microelectronics. The structure, as claimed by the invention, consists of a number of three layers deposited on a carrier wafer (1) of Si (100), of type p, with a resistivity ranging between 5...15 Ω x cm, as follows: a SiOtunnel layer (2) with a size ranging between 3...6 nm, a layer (3) of Ge nanocrystals in SiO, with a size ranging between 7...8 nm and a last SiOcontrol layer with a size ranging between 20...25 nm. The process, as claimed by the invention, has the following steps: cleaning the Si carrier wafer (1) with a Piranha solution at 65°C, treating with ultrasounds in deionized water for 45 min, then immersing it into a HF diluted solution for 15...60 s, drying in a flow of N; thermally growing the SiOtunnel layer (2) at a temperature ranging between 950...1000°C by rapid thermal oxidation, under a mixed atmosphere of Ar and O; depositing the Ge intermediate layer (3) and SiOcontrol layer (4) under Ar atmosphere, at a working pressure of 4 mTorr, using magnetron sputtering, followed by a thermal treatment in Ar, at a temperature of 1000°C, for forming the intermediate layer with Ge nanocrystals, with a density in the range of 10cm, immersed in SiO.
机译:本发明涉及一种用于非易失性存储器的电容器结构,该电容器结构基于浸在SiO中的Ge纳米晶体,并且涉及用于制备该电容器的方法,该结构意在用于微电子学中。根据本发明的结构由沉积在类型为p的Si(100)的载体晶片(1)上的多个三层组成,其电阻率在5 ... 15Ωx cm之间,如下:尺寸在3 ... 6 nm之间的SiO隧道层(2),SiO层中Ge纳米晶体的层(3),尺寸在7 ... 8 nm之间,最后一个SiO2控制层,尺寸在3 ... 6 nm之间在20 ... 25 nm之间根据本发明的方法具有以下步骤:用食人鱼溶液在65°C下清洗Si载体晶片(1),在去离子水中用超声波处理45分钟,然后将其浸入HF稀释溶液中以15 ... 60 s,在氮气流中干燥;在Ar和O的混合气氛下,通过快速热氧化使SiOtunnel层(2)在950 ... 1000℃之间的温度下热生长;使用磁控溅射在Ar气氛下以4 mTorr的工作压力沉积Ge中间层(3)和SiO控制层(4),然后在Ar中以1000°C的温度进行热处理,以形成中间体将具有10厘米范围内的Ge纳米晶体的层浸入SiO中。

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