KIT FOR THERMOSETTING RESIN FILM AND SECOND PROTECTIVE FILM FORMING FILM, THERMOSETTING RESIN FILM, FIRST PROTECTIVE FILM FORMING SHEET, AND METHOD FOR FORMING FIRST PROTECTIVE FILM FOR SEMICONDUCTOR WAFER

摘要

In a kit for a thermosetting resin film and a second protective film forming film, a thermosetting resin film, a first protective film forming sheet, and a method for forming a first protective film for a semiconductor wafer of the present invention, a thermosetting resin film (1) and a second protective film forming film (2) include at least a thermosetting component, wherein the thermosetting resin film (1) has an exothermic onset temperature, as measured by differential scanning calorimetry, that is greater than or equal to the exothermic onset temperature of the second protective film forming film (2), the exothermic peak temperatures of the thermosetting resin film (1) and the second protective film forming film (2) are each 100-200°C, and the difference between the exothermic peak temperatures of the thermosetting resin film (1) and the second protective film forming film (2) is less than 35°C.