A kit of a thermosetting resin film and a second protective film forming film, a thermosetting resin film, a sheet for forming a first protective film, and a method of forming a first protective film for a semiconductor wafer

摘要

A method for forming a kit of a thermosetting resin film and a second protective film forming film, a thermosetting resin film, a first protective film forming sheet and a first protective film for a semiconductor wafer according to the present invention is characterized in that a thermosetting resin film (1) and a second protective film Wherein the thermosetting resin film (1) comprises a thermosetting resin film (1) and the thermosetting resin film (1) has a heat generation starting temperature measured by differential scanning calorimetry is not less than a heat generation starting temperature of the second protective film forming film The exothermic peak temperature of the second protective film forming film 2 is 100 to 200C and the difference between the exothermic peak temperatures of the thermosetting resin film 1 and the second protective film forming film 2 is less than 35C.;