METHOD AND TESTER FOR EVALUATING RESIN DIAMOND WIRE SAW

摘要

Provided are a method and a tester for evaluating the loss of abrasive grains and the peeling of a binder layer on a wire saw during a cutting process without actually using a multi-wire saw to cut. A wire saw is fixed to a jig, and while the jig is made to reciprocate laterally, a test piece disposed perpendicularly to the wire saw fixed onto the jig is lowered, and, defining the point at which the wire saw and the test piece come into contact as the starting point, the change in the load applied by the test piece to the wire saw is measured. The method and tester are used to evaluate the characteristics of a fixed abrasive grain wire saw by dividing the evaluation into multiple stages, specifically, five stages (1st stage: evaluation of slicing into an ingot at the start of cutting; 2nd stage: cutting properties in regions with no occurrence of abrasive grain loss and binder layer peeling; 3rd stage: cutting properties when abrasive grain loss occurs; 4th stage: cutting properties when binder layer peeling starts to occur or has occurred; 5th stage: the snapping point load), and measuring the applied load at each stage.