Evaluation method and testing machine for resin diamond wire saw

摘要

Provided are a method and a tester for evaluating dropout of abrasive grains of a wire saw during cutting work and peeling state of a binder layer without actually cutting it with a multi-wire saw. The wire saw was fixed to the jig and the jig was reciprocated to the left and right while the test piece was placed in a state perpendicular to the wire saw fixed on the jig, the test piece was lowered, the point where the wire saw and the test piece were in contact was taken as the origin , Measure the amount of change in the load with which the test piece presses the wire saw. In the multi-stage, especially 5 stages (1st stage: evaluation of incision into ingot at the start of cutting, 2nd stage: machinability in the area where abrasive grains do not fall off and bond layer does not peel off, 3rd stage: abrasive grains Cutting property at the time of dropout of the bonding layer, 4th stage: starting point of peeling of the binder layer and machinability in peeled state, 5th stage: load up to breakage), and the loading load at each stage A method and a testing machine for measuring and evaluating characteristics of a fixed abrasive wire saw.