THERMAL CONDUCTIVE COPPER POWDER WITH HIGH CAPILLARY RATE AND LOW DENSITY UNDER LOOSE PACKING, AND MANUFACTURING METHOD THEREOF

摘要

A thermal conductive copper powder with high capillary rate and low density under loose packing, and a manufacturing method thereof. Raw materials for manufacturing the powder comprise: a copper oxide powder and an electrolytic copper powder. The copper oxide powder and the electrolytic copper powder are provided in a mass ratio of 2:8 to 8:2. The method comprises: adjusting the ratio of the copper oxide powder and the electrolytic copper powder; mixing the copper oxide powder and the electrolytic copper powder, then performing reductive sintering. A resulting sintered copper then undergoes milling and screening to obtain a thermal conductive copper powder grain. The grain is formed by reductive sintering, binding, and granulation of the copper oxide powder and electrolytic copper powder. The thermal conductive copper powder has high capillary rate and low density when loosely packed. The capillary rate and loose packing density of the thermal conductive copper powder can be adjusted according to the mixing quality of the copper oxide powder and electrolytic copper powder so as to satisfy different product and customer requirements.