THERMALLY CONDUCTIVE, THERMALLY EXPANDABLE RESIN COMPOSITION, THERMALLY CONDUCTIVE, THERMALLY EXPANDABLE MOLDED BODY, BATTERY MODULE, AND BATTERY PACK

摘要

This thermally conductive, thermally expandable resin composition has a heat conductivity at -30 to 80°C of 1 W/m∙K or more, starts expansion at temperatures exceeding 80°C, and has a thermal conductivity of 0.5 W/m∙K or less.