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MICROELECTRONIC DEVICES DESIGNED WITH FLEXIBLE PACKAGE SUBSTRATES WITH DISTRIBUTED STACKED ANTENNAS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS
MICROELECTRONIC DEVICES DESIGNED WITH FLEXIBLE PACKAGE SUBSTRATES WITH DISTRIBUTED STACKED ANTENNAS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS
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机译:设计有柔性包装基板和分布式堆叠天线的微电子设备,用于高频通信系统
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摘要
Embodiments of the invention include a microelectronic device that includes a first substrate having organic dielectric material, conductive layers, and a first portion of a distributed antenna unit. The first substrate supports at least one radio frequency (RF) component. A second substrate is coupled to the first substrate. The second substrate is integrated with a housing of the microelectronic device and includes a second portion of the distributed antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.
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